The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds. Ceramique is engineered to not separate, run, migrate, or bleed and does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive. Ceramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions. Specifications: Thermal Resistance: <0.007°C-in2/Watt (0.001 inch layer) Thermal Conductance: >200,000W/m2.°C (0.001 inch layer) Average Particle Size: <0.38 microns <0.000015 inch ( 67 particles lined up in a row equal 1/1000th of an inch. ) Temperature limits: Peak: –150°C to >180°C Long-Term: –150°C to 125°C Coverage Area: 2.5-gram syringes. (About 1cc) At a layer 0.003" thick, one tube will cover approximately 20 square inches. 22-gram syringes. (About 8cc) At a layer 0.003" thick, one tube will cover approximately 160 square inches.